Wissenschaftliche Veröffentlichungen
Wir forschen und arbeiten kontinuierlich an der (Weiter-)Entwicklung bestehender und neuer Verfahren der Aufbau- und Verbindungstechnik und an Maschinen für den effizienten und zuverlässigen industriellen Einsatz dieser Verfahren. Aus dieser Arbeit sind in den vergangenen Jahren zahlreiche Veröffentlichungen entstanden:
2024
Adaptive Sensor Signal Amplification for Ultrasonic Welding and Wire Bonding
Dr. Matthias Hunstig, Hesse GmbH, Paderborn, Germany – 11.Januar 2024
Technical White Paper [PDF]
2022
Technical and Economical Benefits in Ultrasonic Welding and Bonding by Controlled Cooling of Ultrasound Transducers
Dr. Matthias Hunstig, Hesse Mechatronics, Paderborn, Germany – 21. September 2022
Technical White Paper [PDF]
Batch Constrained Bayesian Optimization for Ultrasonic Wire Bonding Feed-forward Control Design.
Michael Hesse, Matthias Hunstig, Julia Timmermann, Ansgar Trächtler
Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods – Volume 1:
ICPRAM, pages 383-394. DOI: 10.5220/0010806600003122 [online]
2021
Smart Ultrasonic Welding – A Versatile Interconnection Technology for Power Electronics Packaging
Matthias Hunstig, Sebastian Holtkämper, Lars Helmich, Michael Brökelmann
iMAPS Advanced Power Electronics Packaging Symposium (APEPS), virtual event, April 26-29, 2021 [PDF]
2020
Smart Ultrasonic Welding in Power Electronics Packaging
Hunstig, M.; Schaermann, W.; Brökelmann, M.; Holtkämper, S.; Siepe, D.; Hesse, H. J.
CIPS 2020 – 11th International Conference on Integrated Power Electronics Systems, Berlin, Germany, March 24–26, 2020 (originally scheduled date, conference cancelled) [online (VDE Verlag)] [online (IEEE)] [Preprint]
2019
Intelligente Herstellung zuverlässiger Kupferbondverbindungen. Springer, 2019.
Sextro, W.; Brökelmann, M. (Hrsg.)
[online]
Schwingungsanalyse von Chipaufbauten mit Überhangstrukturen hinsichtlich der Bondbarkeit.
Dobs, T.; Höfer, J.; Helmich, L.; Hunstig, M.; Lang, K.-D.
MikroSystemTechnik Kongress 2019, Berlin, 28.–30.10.19, S. 301–304. [Preprint]
Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding.
2018
Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges.
Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding.
Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process.
Effects of different working frequencies on the joint formation in copper wire bonding.
Schemmel, R.; Althoff, S.; Sextro, W.; Unger, A.; Hunstig, M.; Brökelmann, M.
CIPS 2018 – 10th International Conference on Integrated Power Electronics Systems, Stuttgart/Germany, March 20-22, 2018, ETG-Fachbericht 156, VDE-Verlag, 2018, pp. 230-235. [Preprint]
Modellbasierte Schwingungsuntersuchung geklebter Chipaufbauten hinsichtlich ihrer Eignung zum Ultraschall-Drahtbonden.
Panepinto, J.; Dobs, T.; Grams, A.; Höfer, J.; Lang, K. D.; Helmich, L.; Hunstig, M.
Elektronische Baugruppen und Leiterplatten (EBL 2018): Vorträge der 9. DVS/GMM-Tagung in Fellbach am 20. und 21. Februar 2018, DVS-Berichte Band 340, DVS Media, 2018, S. 33-39. [Preprint]
2017
2016
Kupferbondverbindungen intelligent herstellen.
Brökelmann, M.; Unger, A.; Meyer, T.; Althoff, S.; Sextro, W.; Hunstig, M.; Biermann, F. A.; Guth, K.
wt-online 7/8-2016, S. 512-519, 2016.
Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation.
Meyer, T.; Unger, A.; Althoff, S.; Sextro, W.; Brökelmann, M.; Hunstig, M.; Guth, K.
IEEE 66th Electronic Components and Technology Conference, 2016. [online]
2015
Modeling and Simulation of the Ultrasonic Wire Bonding Process.
Meyer, T.; Unger, A.; Althoff, S.; Sextro, W.; Brökelmann, M.; Hunstig, M.; Guth, K.
17th IEEE Electronics Packaging Technology Conference, Singapore, 2015. [online]
Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear.
Unger, A.; Sextro, W.; Meyer, T.; Eichwald, P.; Althoff, S.; Eacock, F.; Brökelmann, M.; Hunstig, M.; Guth, K.
17th IEEE Electronics Packaging Technology Conference, Singapore, 2015. [online]
Copper wire bonding ready for industrial mass production.
Brökelmann, M.; Siepe, D.; Hunstig, M.; McKeown, M.; Oftebro, K.
48th IMAPS International Symposium on Microelectronics, Orlando (FL), USA, Oct. 26-29, pp. 399-405, 2015. [Preprint]
2014
Active Vibration Control in Ultrasonic Wire Bonding.
Brökelmann, M.
Bodo’s Power Systems, December 2014. [Preprint]
Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.
Unger, A.; Sextro, W.; Althoff, S.; Eichwald, P.; Meyer, T.; Eacock, F.; Brökelmann, M.; Hunstig, M.; Bolowski, D.; Guth, K.
47th IMAPS International Symposium on Microelectronics, San Diego (CA), USA, Oct. 13-16, 2014. [Preprint]
Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding.
Unger, A.; Sextro, W.; Althoff, S.; Meyer, T.; Brökelmann, M.; Neumann, K.; Reinhart, R. F.; Guth, K.; Bolowski, D.
8th International Conference on Integrated Power Electronic Systems, ETG-Fachberichte, Vol. 141, pp. 175-180, 2014. [online]
2013
Influences of bonding parameters on the tool wear for copper wire bonding.
Eichwald, P.; Sextro, W.; Althoff, S.; Eacock, F.; Schnietz, M.; Guth, K.; Brökelmann, M.
15th Electronics Packaging Technology Conference (EPTC 2013), pp. 669-672, IEEE, 2013. [online]
2012
Process integrated wire-bond quality control by means of cytokine-Formal Immune Networks.
Montealegre, N.; Hagenkötter, S.
Journal of Intelligent Manufacturing, Vol. 23(3), pp. 699-715, 2012. [online]
Active and Passive Vibration Control of Ultrasonic Bonding Transducers.
Brökelmann, M.; Neubauer, M.; Schwarzendahl, S. M.; Hesse, H.-J.; Wallaschek, J.
ACTUATOR 12 Conference Proceedings, pp. 451-454, Wirtschaftsförderung Bremen, 2012.
Optimization of Bond Transducer Vibrations Using Active and Semi-active Control.
Neubauer, M.; Brökelmann, M.; Schwarzendahl, S. M.; Hesse, H.-J., Wallaschek, J.
Proc. SPIE, Vol. 8341, Active and Passive Smart Structures and Integrated Systems, pp. 83412L, 2012. [online]
2009
Process integrated Wirebond Quality Control and its Industrial Verification.
Hagenkötter, S.; Brökelmann, M.; Hesse, H. J.
IMAPS European Microelectronics and Packaging Conference, Rimini, Italy, 2009. [Preprint]
2008
PiQC – Sensorgestützte prozessintegrierte Qualitäts-Kontrolle beim Drahtbonden.
Hesse, H. J.; Brökelmann, M.; Hagenkötter, S.
in Lindner, K. (Ed.): DVS Jahrbuch Mikroverbindungstechnik 2008/2009, pp.108-129, 2008.
Process Integrated Quality Control for Wire Bonding.
Gilardoni, R.;Hagenkötter, S.; Brökelmann, M.
IMAPS 2008 – 41st International Symposium on Microelectronics, Rhode Island, USA, 2008.
2006
Model for Piezoelectric Actuators with Parallelogram-Kinematics.
Bistry, S.; Brökelmann, M.; Krol, R.; Wallaschek, J.
Proceedings of 2nd International Workshop on Piezoelectric Materials and Applications in Actuators (IWPMA), May 22-26, 2005, pp. 229-230, HNI-Verlagsschriftenreihe, Vol. 180, 2006.
2005
Model Based Development of an Integrated Sensor-Actuator System for Online Quality Monitoring in Ultrasonic Wire Bonding.
Brökelmann, M., Wallaschek, J., Hesse, H. J.
ASME International Mechanical Engineering Congress and Exposition, ASME Conference Proceedings, Vol. 4210X, pp. 219-226, 2005. [online]
2004
Application of Self-Sensing Characteristics of Piezoelectric Transducers in the Quality Monitoring of Ultrasonic Welding Processes.
Brökelmann, M.; Król, R.; Wallaschek, J.; Hesse, H.
Proceedings of the 5th International Conference on Vibroengineering, pp. 6-11, 2004.
A Self-Sensing Transducer for Ultrasonic Wire Bonding.
Brökelmann, M.; Król, R.; Wallaschek, J.; Hesse, H.
Proceedings of the 18th International Congress on Acoustics (ICA 2004), 4-9 April 2004, Kyoto, Japan, Vol. IV, pp. 2901-2904, 2004. [online] (free)
Bond process monitoring via self-sensing piezoelectric transducers.
Brökelmann, M.; Wallaschek, J.; Hesse, H.
Proceedings of the 2004 IEEE International Frequency Control Symposium and Exposition, pp. 125-129, 2004. [online]
2002
A Simple Transducer Model for Longitudinal Flip-Chip Bonding.
Sattel, T.; Brökelmann, M.
IEEE UFFC International Ultrasonics Symposium, October 8-11, Munich, Germany, 2002.