Hesse is announcing its newest applications lab in San Jose for those companies interested in evaluating wire bonding, ribbon bonding and smart welding.

This San Jose site is intended to assist companies with developing the interconnection process for battery packs, power modules, quantum computing chips, MEMS, sensors, and other microelectronics applications. We are capable of wire bonding small to medium volumes of battery packs or other devices.

As application engineer at Hesse Mr. Jack Gilson provides process optimization and support to customers for all types of wire bonding and smart welding applications.

Contact:
Mike McKeown michael.mckeown@hesse-mechatronics.com
+1 (516) 551-8671