Bondjet BJ931

Mechatronic bonheads

E-Box

• Heavy wire and ribbon bondheads for Al, Cu and AlCu:
  • HBK (Frontcut, Backcut); Frequency: 60 kHz*
  • RBK Ribbon (Frontcut); Frequency: 57 kHz*
  • RBK Copper (Frontcut, Backcut); Frequency: 57 kHz*
    alternative frequencies available on request
• Cutting methods: active, passive, air cut (for frontcut)
• Digital ultrasonic generator with PLL (Phase Locked Loop),
  internal frequency resolution <1 Hz; programmable ultrasonic power output
• An intelligent bondhead connecting system with integrated memory stores all calibration data and enables bondhead replacement in a few minutes
• Wire clamp for loop shape control is standard on all bondheads;
  optionally equipped with non destructive pulltest
• Option: Inline pull modules: up to 4 modules per bondhead for a non-destructive pulltest (up to a total of 8 per system)

Wire

• Al, Cu, AlCu: 50 μm – 600 μm** (2 mil – 24 mil)

Ribbon

• Al, Cu, AlCu: 250 µm x 25 µm up to 2000 µm x 400 µm**
  (Cu: 200 µm) (10 mil x 1 mil up to 80 mil x 16 mil)

Loop form functions

• Reproducible loop geometry by wire guide appropriate for the material involved and moving wire buffer
• Constant wire length and loop height
• Mechanically demanding loop geometrics by parameterization and individual wire clamp application
• Individual loop shapes by configurable loop trajectory generator

High speed leadframe indexer

• Strip dimensions :
  100 mm – 280 mm length, 15 mm – 90 mm width,
  max. 3.0 mm down-set
• Substrate types: TO220, SOIC, SO8, SOL8, SOT, SOT23, SC70, power-QFN, QFN, DPAK, DFN, DSO, COB, multi-lead SOP, matrix L/F, flat-boat, programmable pitch etc.
• Index time: 100 ms for typical TO220 device (includes clamping)
• Magazine size: 115 mm – 285 mm length, 20 mm – 100 mm width,
  50 mm – 200 mm height