- High precision touchdown detection without time delay, e.g. for bonding on very thin substrates
- Optimized pattern recognition: image capture with new digital image processing and flash
- Hesse Assist Tools (option):
- E-Box: patented solution for optimized tool change and programmable alignment marks for wedge and wire clamp
- Automated bondforce calibration; a load cell prevents operater error and ensures robust processes
- Innovative bondtool detection
- Automated bondtool calibration without wedge gauge
- Loop generator for individualized loops
- Wear-free components with Piezo technology
- Maintenance-free solid state joints
- Pre-setting of bondheads via EEPROM
Deep Access Bondhead
Flexibilty
- Flexible use of working area, e.g. with a number of bonding stations (manual loading or with indexers)
- Universal software interface for indexer control
- Maximization of throughput by automation with two or more
parallel lines
Speed
- Up to 7 wires per second, depending on application and bondhead,
e.g. wedge-wedge bondhead, 25 μm wire, 1 mm loop length, metallized wafer
Quality
- Continuous real time monitoring of wire deformation, transducer current, frequency and impedance within programmable control limits
- Process integrated Quality Control PiQC: detection of further parameters, e.g. friction behavior, by additional sensor system for 100 % quality monitoring in real time (patented); as option
Mechatronic bondheads
- Wedge-Wedge bondhead 45°, 60°, 90° (deep access for ribbon or wire)
- Freely programmable wire feed, tail length, tear stroke and opening gap of wire clamp
Precise bondforce control (static and dynamic)
Bondheads can be replaced in minutes
- Freely programmable wire feed, tail length, tear stroke and opening gap of wire clamp
- Ball-Wedge bondhead
- Multi-level bonding according to Z axis stroke of 31 mm (1.22″)
11/19 mm capillaries
Ultrasonic in preferred direction by bondhead rotation
- Multi-level bonding according to Z axis stroke of 31 mm (1.22″)
- Digital ultrasonic generator with PLL (Phase Locked Loop),
internal frequency resolution <1 Hz; programmable ultrasonic power output
Wire
- Al, Au, Ag, Cu, Pt: 12,5 μm – 75 μm*
Ribbon
- Al, Au: 35 μm x 6 μm up to 250 μm x 25 μm*
Fine wire loop design
- Loop generator for individualized loops
Loop form functions: constant wire length, constant loop height, individual loop shapes
Fine pitch (wedge-wedge): 40 µm inline, 25 µm staggered/dual line (depending on wire diameter and loop)
Working area
| Bonder | X | Y | Z |
| BJ855 | 305 mm | 410 mm | 19mm |
| BJ885 | 370 mm | 870 mm | 19mm |
Footprint and weight
| Bonder | W x D x H [mm] | Weight |
| BJ855 | 740 x 1484 x 1912 | ca. 1150 kg |
| BJ885 | 880 x 1780 x 1912 | ca. 1800 kg |
| excl. attached parts like e.g. status lamp, control panel etc. | ||
Media connectivity
- Power supply 230V AC
- Gigabit-Ethernet (TCP/IP)
- USB-Ports
- HDMI
- Compressed air (CDA clean, dry air)
- Vacuum
* depending on bondhead, application, wire
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